Refractory Metals and Composites
The following topics will be addressed during the 20th Plansee Seminar:
1. | Applications | |
1.1. | Transportation | |
1.2. | Electronics | |
1.3. | Thermal management | |
1.4. | Lighting technology | |
1.5. | Medical technology | |
1.6. | Power engineering | |
1.7. | Chemical engineering | |
1.8. | Coating technology | |
1.9 | Joining technology | |
1.10. | Metal, glass, and ceramics production | |
1.11. | High temperature furnaces and devices | |
1.12. | New areas | |
2. | Materials | |
2.1. | Refractory metals and alloys, composites, laminates, and functionally graded materials | |
2.2. | High entropy alloys (HEA) based on refractory metals | |
2.2. | Refractory metals based intermetallics | |
3. | Powder | |
3.1. | Powder production and processes | |
3.2. | Extractive metallurgy | |
3.3. | Recycling | |
4. | P/M processes | |
4.1. | Mixing, alloying, and doping | |
4.2. | Compaction, forming, and near net shaping | |
4.3. | Additive manufacturing and rapid prototyping | |
4.4. | Sintering and infiltration | |
4.5. | Hot isostatic pressing, hot pressing, and spark plasma sintering | |
4.6. | New consolidation processes | |
4.7. | Surface engineering and coating | |
4.8. | Joining | |
5. | Simulation and Modeling | |
5.1. | Materials and microstructure | |
5.2. | Stresses and deformation | |
5.3. | Failure and reliability | |
5.4. | Oxidation and corrosion | |
5.5. | Constitutive and multiscale modeling | |
5.6 | Components and devices | |
5.7. | Data processing | |
6. | Characterization and Testing | |
6.1. | Microstructure | |
6.2. | 3D and nanoscale characterization | |
6.3. | Destructive and nondestructive inspection |